Laminate Package Technology

Ball Grid Array Packaging


Ball Grid Array Technology

Array substrate-based packaging represents one of the fastest growing areas in the semiconductor packaging industry and is used in computing platforms, networking, hand-held consumer products, wireless communications devices, home electronic devices and game consoles, among other applications.

BGA technology was first introduced as a solution to problems associated with the increasingly high lead counts required for advanced semiconductors used in applications such as portable consumer devices and wireless telecommunications. As the number of leads surrounding the integrated circuits increased, high lead count packages experienced significant electrical shorting problems. BGA technology solved this problem by effectively creating and array of leads on the bottom surface of the package in the form of small bumps or solder balls.

STATS ChipPAC offers a comprehensive range of laminate-based BGA packaging options:
  • FBGA - the Fine Pitch Ball Grid Array package is a laminate substrate-based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. FBGA is also available in stacked configurations (FBGA-SD).
  • FLGA - the Fine Pitch Land Grid Array package is a laminate substrate-based package with plastic overmolded encapsulation. Unlike a standard FBGA, second level interconnect is achieved on the LGA by connecting "lands" on the package directly onto the PCB through solder re-flow. FLGA is also available in stacked configurations (FLGA-SD).
  • PBGA - the Plastic Ball Grid Array package is a cavity-up laminate substrate-based package in which the die is attached (die up) to the substrate. The wirebonded device and the complete assembly are then overmolded and solder balls attached to form the package. PBGA is available in thermally enhanced (PBGA-H), multi-die (PBGA-MD) and stacked die options (PBGA-SD).
  • X Thin BGA - the Extremely Thin Profile Array package’s extra thin design allows a full array of solder balls or lands on the substrate to deliver greater flexibility in input/output (I/O), layout and density in a given package size.
  • Advanced Stacked Packages - Multi-die stacking provides a high level of functional integration in well established package families by stacking die or stacking packages or a mix of both, using a mix of assembly technologies. The types of stacked packages are often characterized by how they are stacked, as chips, packages or passives. In addition to standard stacked packages, STATS ChipPAC offers a range of Package-on-Package (PoP) and Package-in-Package (PiP) configurations.

STATS ChipPAC’s laminate packages are available in a variety of JEDEC standard thicknesses, including:
  • "thin" BGA and LGA package options (i.e., TFBGA, TFLGA)
  • "very thin" BGA and LGA package options (i.e., VFBGA, VFLGA)
  • "very, very thin" BGA and LGA package options (i.e., WFBGA, WFLGA)
  • "ultra thin" BGA and LGA package options (i.e., UFBGA, UFLGA)
  • "extremely thin" BGA and LGA package options (i.e., XFBGA, XFLGA)


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