STATS ChipPAC’s patent portfolio recognized for its quality, strength and overall importance to the semiconductor manufacturing industry
Singapore – 8 January 2013 –
STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” – SGX-ST: STATSChP), a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked among the top 10 semiconductor manufacturing companies in the world for its patent portfolio and innovations by the Institute of Electrical and Electronics Engineers (IEEE), the world’s largest professional association for the advancement of technology, and 1790 Analytics, an Intellectual Property (IP) evaluation firm.
This is the second consecutive year that STATS ChipPAC has ranked among the top 10 semiconductor manufacturing companies in the world on the IEEE Spectrum’s Patent Power Scorecard, a rating of the most valuable United States patent portfolios. STATS ChipPAC was ranked number 6 on the 2012 scorecard in the Semiconductor Manufacturing category. STATS ChipPAC’s recognized strength in intellectual property (IP) and technology innovations are fundamental to the most advanced semiconductor integrated circuits (IC) in the market today. Recent advanced technologies developed by STATS ChipPAC that are rapidly gaining widespread traction across the semiconductor packaging industry include:
- Fine pitch flip chip packages with copper column bump featuring Bond-on-Lead (BOL) interconnection, both with Mass Reflow (MR) and Thermo-Compression Bonding (TCB) processes;
- Fan-out wafer-level packaging (FOWLP) that provides a breakthrough in package density and form factor together with the fan-in wafer level packaging option; and
- 2D/2.5D/3D integration solutions which deploy combinations of FOWLP and Through Silicon Via (TSV) schemes for seamless packaging solutions across the design space.
“The growth in the electronics mobility and convergence markets today is significantly driven by technology innovations. STATS ChipPAC is a leader in advanced packaging and our proven technology portfolio provides us with the capabilities to develop world class solutions for our customers through higher levels of IC integration, improved electrical performance, reduced power consumption, faster speed and smaller electronic devices. Over 60% of our patent portfolio comprises advanced or future technologies and our concentration of such enabling technologies had earned us a high ranking among the industry’s top companies in semiconductor manufacturing,” said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.
“Through our strategic relationships with Original Equipment Manufacturers (OEMs) and semiconductor industry leaders, STATS ChipPAC’s internal innovation teams are constantly collaborating with industry leaders to develop and enable the next generation of electronic devices. The visibility of new product trends and collaborations provide a channel that supports strong alignment between innovation and market demand to provide solutions that have a clear market proposition and application. We have an established IP licensing program to further provide our customers with multi-sourcing options to support supply chain strategies for their advanced products.”
The Patent Power Scorecards published by IEEE Spectrum are available on the following web pages:
2012 Scorecard: http://spectrum.ieee.org/ns/pdfs/2012Patentscorecard2a.pdf
2011 Scorecard: http://spectrum.ieee.org/ns/pdfs/2011.PatentFinal.pdf
Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, the timing and impact of the expected closure of the Thailand Plant as well as the estimated associated cost for the closure; the amount of the business interruption insurance claim due to flooding of the Thailand Plant; the ability to shift production to other manufacturing locations, shortages in supply of key components and disruption in supply chain; general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilisation; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; customer credit risks; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of our Company as a passive foreign investment company; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited (“Temasek”) that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labour union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; the continued trading and listing of our ordinary shares on the Singapore Exchange Securities Trading Limited (“SGX-ST”). You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.