Download full pdf version Singapore – 25 October 2012
– STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” – SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced results for the third quarter 2012.
Tan Lay Koon, President and Chief Executive Officer of STATS ChipPAC, said, “Third quarter revenue of 2012 decreased by 3.4% to $408.3 million compared to the prior quarter, and was affected by delay in supply of advanced silicon node wafers for high end smartphones and weakness in the PC and consumer end markets, offset by higher demand in the wireless communication market.”
Gross margin for the third quarter of 2012 was 16.0% compared to 17.0% in the second quarter of 2012 and 17.0% in the third quarter of 2011. Operating margin before goodwill and equipment impairment and flood related income (expenses) for the third quarter of 2012 was 6.5% of revenue compared to 7.9% in the second quarter of 2012 and 8.3% in the third quarter of 2011. In the third quarter of 2012, goodwill and equipment impairment of $27.9 million was recorded in connection with the Malaysia plant to mainly align with the transition of technology in certain customers from leaded wirebonding to advanced packaging.
for the third quarter of 2012 was $3.2 million compared to net income of $8.9 million in the second quarter of 2012 and $18.0 million in the third quarter of 2011. The net income in the third quarter of 2012 included $26.7 million of property damage insurance settlement as compensation for plant and equipment damages arising from the flooding of the Thailand plant and $27.9 million of goodwill and equipment impairment.
John Lau, Chief Financial Officer of STATS ChipPAC, said, “Gross profit for the third quarter of 2012 was $65.2 million or 16.0% of revenue, compared to $71.7 million or 17.0% in the second quarter of 2012 and $75.2 million or 17.0% in the third quarter of 2011. Our adjusted EBITDA2
in the third quarter of 2012 including $26.7 million insurance settlement was 29.9% of revenue, compared to 23.0% in the second quarter of 2012 and 24.3% in the third quarter of 2011. Capital spending in the third quarter of 2012 was $159.6 million or 39.1% of revenue compared to $96.8 million or 22.9% in the second quarter of 2012 and $70.3 million or 15.9% in the third quarter of 2011. The third quarter of 2012 capital spending was focused on capacity expansion in advanced wafer level packaging and turnkey test for the high end smartphones market and included $13.2 million for the new factory building in Singapore. We ended the third quarter of 2012 with cash, cash equivalents and marketable securities of $195.5 million and debt of $842.4 million compared to $238.1 million and $810.3 million as of the end of fourth quarter of 2011, respectively. We have received cash of $37.1 million in October 2012 from the property damage insurance settlement and proceeds from the associated company divestment.” Outlook
Tan Lay Koon commented, “Based on current visibility, we expect net revenues in the fourth quarter of 2012 to be approximately 2% to 8% increase compared to the prior quarter, with adjusted EBITDA2
in the range of 21% to 27% of revenue. We expect capital expenditure3
in the fourth quarter of 2012 to be approximately $40 million to $50 million.”
The outlook is subject to a number of risks and uncertainties that could cause actual events or results to differ materially from those disclosed in the outlook statements. These statements are based on our management’s beliefs and assumptions, which involve judgments about future trends, events and conditions, all of which are subject to change and many of which are beyond our control. Please refer to our Financial Statements for the three and nine months ended 23 September 2012 filed with the Singapore Exchange Securities Trading Limited (“SGX-ST”) for the major assumptions made in preparing our outlook for the fourth quarter of 2012. Investors should consider these assumptions and make their own assessment of the future performance of STATS ChipPAC and note that there may not be a direct correlation between the net income of the Company with adjusted EBITDA as a percentage of revenue. Investor Conference Call / Live Audio Webcast Details
A conference call has been scheduled for 8:00 a.m. in Singapore on Monday, 29 October 2012. During the call, time will be set-aside for analysts and investors to ask questions of executive officers.
The call may be accessed by dialing +65-6723-9381. A live audio webcast of the conference call will be available on STATS ChipPAC’s website at www.statschippac.com. A replay of the call will be available 2 hours after the live call through 13 November 2012 at www.statschippac.com and by telephone at 800-616-3021. The conference ID number to access the conference call and replay is 34644137.
The net income in the third quarter of 2012, the second quarter of 2012 and the third quarter of 2011 included interest expense of $11.2 million from our offering of $600.0 million Senior Notes due 2015 to fund our capital reduction in 2010.2
Adjusted EBITDA is not required by, or presented in accordance with, Singapore Financial Reporting Standards (“FRS”). We define adjusted EBITDA as net income attributable to STATS ChipPAC Ltd. plus income tax expense, interest expense, net, depreciation and amortisation, restructuring charges, share-based compensation, goodwill and equipment impairment, tender offer expenses and write-off of debt issuance cost. We present adjusted EBITDA as a supplemental measure of our performance. Management believes the non-FRS financial measure is useful to investors in enabling them to perform additional analysis.3
Capital expenditure refers to acquisitions of production equipment, asset upgrades and infrastructure investments.
Certain statements in this release are forward-looking statements, including our outlook for the fourth quarter of 2012, that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, the timing and impact of the expected closure of the Thailand Plant as well as the estimated associated cost for the closure; the amount of the business interruption insurance claim due to flooding of the Thailand Plant; the ability to shift production to other manufacturing locations, shortages in supply of key components and disruption in supply chain; general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilisation; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; customer credit risks; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of our Company as a passive foreign investment company; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited (“Temasek”) that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labour union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; the continued trading and listing of our ordinary shares on the Singapore Exchange Securities Trading Limited (“SGX-ST”). You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.
Basis of Preparation of Results
The financial statements included in this release have been prepared in accordance with the Singapore Financial Reporting Standards (“FRS”).
Our 52-53 week fiscal year ends on the Sunday nearest and prior to 31 December. Our fiscal quarters end on a Sunday and are generally thirteen weeks in length. Our third quarter of 2012 ended on 23 September 2012, while our second quarter of 2012, third quarter of 2011 and fiscal year 2011 ended on 24 June 2012, 25 September 2011 and 25 December 2011, respectively. References to “$” are to the lawful currency of the United States of America.
Overall equipment utilisation for the second and third quarter of 2012 are adjusted for the suspension of the Thailand Plant capacity.
Commencing with the third quarter of 2012, we are reporting net revenues by the advanced packaging, wirebond packaging and test product lines to align with our business focus. We have similarly disclosed net revenues by advanced packaging, wirebond packaging and test for the second quarter of 2012 and the third quarter of 2011. We have previously reported net revenues by packaging-laminate, packaging-leaded, test and wafer level processing and other services.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.