United States – 7/21/2008, Singapore – 7/22/2008 – STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” – SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced it has won the 2008 Advanced Packaging Award in the 3D Packaging Technology category for its Flip Chip Package-In-Package solution. This is the second consecutive year in which STATS ChipPAC has been honored by the Advanced Packaging Awards for achievements in 3D packaging technology. In 2007, STATS ChipPAC won the 3D Packaging Award for its innovative Fan-in Package-on-Package (FiPoP) technology.
Flip Chip Package-In-Package (fcPiP) is an advanced flip chip integration technology that combines the baseband, memory and analog functions of a mobile communication device into a single package. The fcPiP effectively integrates flip chip and wire bond interconnection within the same package structure to deliver increased speed, performance and miniaturization. It provides greater functional integration in a smaller form factor with an overall reduction in total cost as compared to other 3D package stacking solutions and is ideal for mobile phones and other portable consumer electronics.
“We are very honored to receive the 2008 Advanced Packaging Award for our fcPiP technology. The fcPiP is a flip chip integration package with an innovative architecture that combines multiple package integration schemes within a very small package to die ratio. The combined greater functional integration in a smaller form factor with an overall reduction in total cost as compared to other 3D package stacking solutions will help our customers to be even more successful in the highly competitive mobile phone and other handheld applications market,” said Dr. Han Byung Joon, STATS ChipPAC’s Executive Vice President and Chief Technology Officer.
Instituted in 2004, the Advanced Packaging Awards honor the products and technologies that have shaped the semiconductor industry over the years. This year’s program recognized outstanding companies with innovative technology advancements in 19 categories, one of which was 3D Packaging. Selection criteria for the winners of the Advanced Packaging Awards were evaluated based on their ability to meet a significant industry challenge, creative application of a new or existing technology, overall quality and consistency of performance, economic merits, and throughput characteristics.
The winners of the 2008 Advanced Packaging Awards were recognized during a ceremony that took place on July 16, 2008 at the St. Regis Hotel, San Francisco.
Forward-Looking Statements
Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, general business and economic conditions and the state of the semiconductor industry; level of competition; demand for end-use applications products such as communications equipment and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; availability of financing; prevailing market conditions; our ability to meet the applicable requirements for the termination of registration under the Exchange Act; our ability to meet specific conditions imposed for the continued listing or delisting of our ordinary shares on the Singapore Exchange Securities Trading Limited (SGX-ST); our substantial level of indebtedness; potential impairment charges; delays in acquiring or installing new equipment; adverse tax and other financial consequences if the South Korean taxing authorities do not agree with our interpretation of the applicable tax laws; our ability to develop and protect our intellectual property; rescheduling or canceling of customer orders; changes in our product mix; intellectual property rights disputes and litigation; our capacity utilization; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; changes in customer order patterns; shortages in supply of key components; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited (Temasek) that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labor union problems in South Korea; uncertainties of conducting business in China and other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; and other risks described from time to time in the Company’s SEC filings, including its annual report on Form 20-F dated March 7, 2008. You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.ir.statschippac.com. Information contained in this website does not constitute a part of this release.