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STATS ChipPAC Press Releases

Dec 16, 2014STATS ChipPAC Receives Top 20 Semiconductor Manufacturing Patent Ranking for Fourth Consecutive Year
Oct 28, 2014STATS ChipPAC Reports Third Quarter 2014 Results
Sep 22, 2014STATS ChipPAC Announces Resignation of Chief Operating Officer
Sep 17, 2014STATS ChipPAC Provides Update for Third Quarter 2014
Aug 20, 2014STATS ChipPAC’s fcCuBE® Technology Surpasses 100 Million Unit Milestone
Aug 08, 2014STATS ChipPAC Reports Second Quarter 2014 Results
Aug 06, 2014STATS ChipPAC Honours Top Suppliers for Excellent Performance and Outstanding Support
Jul 29, 2014STATS ChipPAC’s Encapsulated Wafer Level Chip Scale Package (eWLCSP™) Delivers Superior Quality Benefits
May 28, 2014STATS ChipPAC Introduces Robust Encapsulated Wafer Level Packaging Technology
Apr 28, 2014STATS ChipPAC Conferred Singapore’s Prestigious Distinguished Partner in Progress Award
Apr 22, 2014STATS ChipPAC Reports First Quarter 2014 Results
Apr 14, 2014STATS ChipPAC Appoints New Chief Financial Officer
Mar 28, 2014STATS ChipPAC Announces Resignation of Chief Financial Officer
Mar 11, 2014STATS ChipPAC Introduces Breakthrough Manufacturing Method for Wafer Level Packaging
Feb 26, 2014STATS ChipPAC’s fcCuBE® Technology Achieves Significant Growth in 2013
Jan 29, 2014STATS ChipPAC Reports Fourth Quarter and Full Year 2013 Results
Jan 22, 2014STATS ChipPAC Recognised for Patent Innovations for the Third Consecutive Year by IEEE

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