Computing/Data Storage Solutions
Solutions that take your products to market and volume faster . . .
The computing segment demands both high performance as well as low cost packaging and test solutions. To support these requirements, STATS ChipPAC offers a broad package portfolio, ranging from high performance Flip Chip packages to low cost, advanced leadframe CSPs such as QFN and CSMP, all supported by a wide variety of tester platforms and peripheral support.
CPU Processing Solutions
Central processing units (CPUs) are devices that execute external instructions and perform system control functions as programmed via software, with the assembly language instructions retrieved from external memory and data read from and written to external RAM devices to perform system functions.
This setup allows the microprocessing unit to receive a variety of input commands, manipulate data, direct the storage of data and initiate application commands to the outside world.
CPU chipsets require packages with good heat dissipation capability and high I/O count (308 to 1848 I/O). 95% of the packaging solutions used for CPU processing use advanced Flip Chip BGA’s or thermally enhanced Flip Chip LFBGA packaging because these chipsets are powerhouse ICs.
Graphics Processing Solutions
Graphics and imaging devices are used to control, display or create real or virtual images. Devices included in this family are graphic controllers that control monochrome or color video, PC graphics processors, embedded graphic accelerators, image encoders or decoders for conforming data to MPEG, JPEG or similar standard specifications for digital video and audio compression.
Graphic processing chipsets use Flip Chip packaging to maintain high I/O count within a small footprint. Demand for higher definition and million pixel resolution to achieve life-like images has resulted in the need for thermally enhanced packaging solutions.
STATS ChipPAC is a trusted provider to leading graphics fabless companies, offering graphics processing packaging solutions that include fcBGA-H, fcLFBGA-H, fcLGBGA-SiP-SD and fcLGA.
Data Storage Processing Solutions
Storage chips control data storage in and retrieval from magnetic or optical mass storage media such as hard disk drives or solid state drives.
STATS ChipPAC has extensive experience in this application through its solid engagement with market leaders in SAS/SATA/SCSI channel readers and controller device packaging and test.
STATS ChipPAC’s solutions range from leadframe CSP products like QFN and TQFP to WLCSP and LFBGA, and we are well positioned for the future solid state drive market where the majority of storage controller devices will be packaged as WLCSP and QFN.
Memory Processing Solutions
STATS ChipPAC offers a wide variety of low cost solutions for different PC Memory devices. STATS ChipPAC’s solutions for Memory processing in the PC market segment primarily target PSRAM, SRAM, AMB and NAND flash devices.
For PSRAM/SRAM, we offer TFBGA-BOC and Array CSP package solutions. AMB is primarily supported with Flip Chip BGA due to minimum electrical parasitic and latency losses requirements in handling high thermal and electrical powered devices.
For NAND flash devices, most of its applications are currently found in the consumer market segment rather than in the PC market segment. A potential change to this scenario would be the mass adoption of flash-based solid state drives. Currently most SSD’s are manufactured in low volume production. The packaging type used in SSD’s is typically the TSOP-SD, which, however, will eventually migrate to FBGA-SD using through silicon via (TSV) interconnect.
STATS ChipPAC has a research and development facility dedicated to developing next generation technology such as TSV and microbump bonding for three dimensional (3D) die, silicon substrate based packaging solutions, and embedded active die technology.
PC Market Solutions at STATS ChipPAC
A summary of all major applications in the PC market segment with their associated packages and test solutions are listed below.