RF Applications
Consumers’ relentless passion for increased media features, wireless connectivity, small form factors, lower cost and power in their mobile products are driving the wireless market to record levels. Never before have there been so many RF technologies to choose from to enable wireless communication in so many devices. Mobile transceivers, receivers, single-chip Bluetooth, wireless LAN (802.11 a/b/g/n), GPS, WiMAX and UWB are among the RF wireless communications devices available in the market today. These devices are often packaged individually or within the front-end module (FEM) of a wireless application together with passive components or an integrated passive device (IPD).
Leadership in RF Solutions
STATS ChipPAC has direct experience and knowledge in many of the major wireless technologies in both assembly and test.
- Mobile phones and mobile handsets: GSM, CDMA, WCDMA
- Mobile TV: 3G, DVB-H, DMB, MediaFLO
- Wireless Personal Area Networks (PAN): Bluetooth, UWB, SD (Secure Digital), RFID
- Wireless Local Area Networks (WLAN): 802.11x, WiFi
- Wireless Metropolitan Area Networks (MAN): 802.16x (WiMAX)
- Wireless Wide Area Networks (WAN): 3G, WCDMA, GPRS, EDGE, UMTS, LTE
- Wireless control: Zigbee, Mesh
- System-on-Chip (SOC), System-in-Package (SIP) and other 3D systems in package with RF components
Given rising market demand, electronics manufacturers are confronted with unprecedented challenges of device integration in the smallest form factors to date. Product managers can now choose between incorporating multiple and sophisticated RF, Baseband, and Power Management functions into a single chip (SOC), or System-in-Package (SIP). Consequently, added design complexity and other technical issues are leading to higher start-up costs, increased pressure on time to market, and lost revenue opportunities.
STATS ChipPAC offers a complete turnkey solution to resolve these device integration challenges no matter which path you choose.
RF Packaging Solutions
STATS ChipPAC is the recognized market leader in providing integrated RF assembly and test solutions. Today, we ship millions of standard QFN, FBGA, & PBGA packages for placement into wireless applications. We also provide the latest technologies in IC packaging: Wafer Level Package (WLCSP), Flip Chip (FC), System-in-Package (SiP), Stacked-die Packaging (3D), Integrated Passive Devices (IPD), Package-in-Package (PiP) and Package-on-Package (PoP). STATS ChipPAC’s engineers will partner with your designers, from early product design development to high volume production, to produce the ideal package solution to meet your specifications.
RF Test Solutions
STATS ChipPAC has also developed comprehensive RF test capabilities to optimize the high frequency bandwidth requirement of RF devices, offering Known Good Die (KGD) services to optimize your test program and enhance yield while reducing your cost of test (COT). STATS ChipPAC has the largest and broadest RF test platform install base in the OSAT industry and a dedicated RF test development team to support our customers’ needs.
Comprehensive RF Services
STATS ChipPAC’s objective is to provide services that exceed your expectations. Our engineering services offer RF system design and simulation along with thermal and electrical modelling. We can offer a comprehensive suite of e-Business services to help you efficiently manage your supply chain, including invoicing, payment, forecasting, procurement, logistics tracking and drop shipment. As a leader in the OSAT industry, STATS ChipPAC’s ultimate vision is to provide advanced packaging, test, and supply chain services to meet your wireless requirements.
Success Story:
Assembly and Test of Highly Integrated RF Products 
When package size and cost matter, STATS ChipPAC offers its customers the lowest cost method to easily integrate an RF component with any digital or baseband component to create an RF system in a package with extremely small dimensions. STATS ChipPAC can accomplish this due to its leadership and experience in IPD (Integrated Passive Devices and components etched onto silicon) and other wafer level products, which is exemplified by the Wireless LAN system in a package illustration.
Similar integration of an RF module with baseband and digital modules into a single package can be achieved using a STATS ChipPAC stacked die solution.
These advanced RF system packages require multiple test stages at both wafer level and final test. From its leadership in advanced packages, STATS ChipPAC has developed a complementary leadership in the testing of these advanced packages with Known Good Die test strategies that enable its customers to minimize both test costs and test losses when testing these advanced RF packages and devices.
RF Solutions at STATS ChipPAC
A summary of all major applications in the RF market segment with their associated packages and test solutions are listed below.