Mobile Communication Applications

Overview

Wireless mobility is defined by the ability of an end user to carry a mobile application anywhere and everywhere without any operating issues. Assembly and test solutions for mobile devices are often complicated and require the latest enabling technologies to underpin the device’s integration functionality.

The following section outlines the major technology clusters in the Wireless Communication market and the respective solutions that STATS ChipPAC offers.

Radio Frequency (RF) Solutions

Mobile transceivers, receivers, single-chip Bluetooth, wireless LAN (802.11 a/b/g/n), GPS, WiMAX and UWB are among the RF wireless communications devices available in the market today. These devices are often packaged individually or within the front-end module (FEM) of a wireless application together with passive components or an integrated passive device (IPD).

STATS ChipPAC is the recognized market leader in providing integrated RF assembly and test solutions. Types of packages used in RF packaging include QFN, BCC, CSMP/IPD, BGA-SiP, WLCSP, LFLGA-SiP and fcPiP-SiP.

STATS ChipPAC has also developed comprehensive RF test capabilities to optimize the high frequency bandwidth requirement of RF devices, offering Known Good Die (KGD) services to reduce the cost of test (COT). STATS ChipPAC has one of the largest and broadest RF test platform install bases in the OSAT industry and a dedicated RF test development team to support our customers’ needs.

STATS ChipPAC can partner with your IC designers, from early product design development to mass production, to implement the ideal RF SiP/CSMP package solution to meet your specifications. 

Find out more about how STATS ChipPAC can support your RF Applications.

Baseband Solutions

Baseband is often considered the ‘brain’ of a telecommunications system, where the digital or analog data in its original electronic form is multiplexed with data from ASIC/ASSP or transceivers prior to being carried in a modulated carrier wave form.

Since the I/O count of a baseband is usually in the range of a few hundred, the most applicable package type being widely used is L/TFBGA.

With more integration occurring in the digital cluster of a wireless application, however, die stacking and package stacking are becoming more effective baseband solutions. Package-on-Package (PoP), Package-in-Package (PiP) and other variants of package stacking like fcPoP, Fan-In PoP and fcPiP are now becoming more widely used to integrate the application processor (ASSP), power management IC, PSRAM and NOR/NAND flash ICs.

STATS ChipPAC is highly experienced in producing these advanced integrated packages, and can customize your solutions for achieving seamless integration to reap the benefits of board-level real estate savings.

Power Management Solutions

Increasing need for greater functionality has pushed the number of device I/O to greater highs, with the unfortunate result of increased heat generation, localized within the integrated circuit. To regulate and minimize the usage of current during peak periods, power management ICs are added into the integrated circuit to cut off, regulate as well as convert certain devices to idling mode using multiple stepping and syncronizing functions.

Power management IC’s usually require a robust CSP form-factor. STATS ChipPAC provides high volume, reliable CSP’s like QFN, QFP and SOIC for such applications.

Mobile Memory Solutions

Storage demand in wireless applications, mobile phones in particular, has reached a new high thanks to the integration of the MP3 player, video recording or playback and picture capturing functions. Such storage capacity is either built-in or removable. One of the most distinctive removable storage modes is through the Secured Memory Card (SD card).

STATS ChipPAC produces various versions of the Memory Card which meet SD Association standards and specifications. These include the:

• Mini SD Card
• Micro SD Card
• MS ProDuo Memory Stick
• SD-USB Memory Card

STATS ChipPAC provides full turnkey solutions for memory card production and is in high volume production today.

Wireless Communication Solutions at STATS ChipPAC

A summary of all major applications in the Wireless Communications market segment with their associated packages and test solutions are listed below.

Application	Package Type	Test Technology
Radio Frequency	BCC	RF Test, Digital RF SoC Test
	CSMP/IPD	RF Test, Digital RF SoC Test
	LFLGA	RF Test, Digital RF SoC Test
	LFLGA-SiP	RF Test, Digital RF SoC Test
	LFBGA-SiP-SD	RF Test, Digital RF SoC Test
	LFLGA-SiP-SS	RF Test, Digital RF SoC Test
	QFN	RF Test, Digital RF SoC Test
	QFP-SD	RF Test, Digital RF SoC Test
	WLCSP	RF Test, Digital RF SoC Test
Baseband	fcPiP	Digital Test, Digital RF SoC Test
	fcVFBGA-SiP	Digital Test, Digital RF SoC Test
	FiPoP	Digital Test, Digital RF SoC Test
	L/T/VFBGA	Digital Test, Digital RF SoC Test
	PiP	Digital Test, Digital RF SoC Test
	PoP	Digital Test, Digital RF SoC Test
	T/VQFP	Digital Test, Digital RF SoC Test
Power Management	BCC	Power Logic Test
	QFN	Power Logic Test
	TSOP	Power Logic Test
Mobile Memory	Memory Dual Pro-stick	Memory Test
	MS Micro	Memory Test
	Mini-SD Card	Memory Test
	MS ProDuo	Memory Test
	SD Card	Memory Test
	SD-USB	Memory Test
	SD-SiP-SD	Memory Test
	USB Pro-stick	Memory Test
	MicroSD	Memory Test

 

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