Communications Solutions

Solutions that take your products to market and volume faster . . .



The demands of a hyper-connected society in the 21st century has intensified the growth of both wired and wireless communications equipment, tools and related electronics gadgets. This growth is spurring the development of a seamless interconnected infrastructure.

As a result, the communications market segment is now characterized by the following attributes:

• shorter device life span
• rapid miniaturization
• higher integration
• relentless cost reduction demands

Semiconductor chipmakers are confronted with unprecedented integration challenges in packaging and testing their new wireless products. STATS ChipPAC’s unique position as the industry leader in 3D solutions can help minimize wireless semiconductor chipmakers’ time-to-market for new product introduction.

Mobile / Wireless Communication Applications

Wireless mobility is defined by the ability of an end user to carry a mobile application anywhere and everywhere without any operating issues. Assembly and test solutions for mobile devices are often complicated and require the latest enabling technologies to underpin the device’s integration functionality.

The following section outlines the major technology clusters in the wireless communication market and the respective solutions that STATS ChipPAC offers.

• Radio Frequency (RF)
• Baseband
• Power Management
• Mobile Memory

Find out more about how STATS ChipPAC can support your Mobile Communication Applications.

Network / Wirelined Communication Applications

Each of these applications require different packaging and testing solutions. The following section targets the major technology clusters within the wirelined communication market and the respective solutions that STATS ChipPAC offers.

• Broadband / xDSL
• Cable Modem
• Ethernet
• Digital Signal Processing

Find out more about how STATS ChipPAC can support your Network and Wireline Communication Applications.

Communication Solutions at STATS ChipPAC

A summary of all major applications in the Communications market segment with their associated packages and test solutions are listed below.

Application	Package Type	Test Technology
Radio Frequency	BCC	RF Test, Digital RF SoC Test
	CSMP/IPD	RF Test, Digital RF SoC Test
	LFLGA	RF Test, Digital RF SoC Test
	LFLGA-SiP	RF Test, Digital RF SoC Test
	LFBGA-SiP-SD	RF Test, Digital RF SoC Test
	LFLGA-SiP-SS	RF Test, Digital RF SoC Test
	QFN	RF Test, Digital RF SoC Test
	QFP-SD	RF Test, Digital RF SoC Test
	WLCSP	RF Test, Digital RF SoC Test
Baseband	fcPiP	Digital Test, Digital RF SoC Test
	fcVFBGA-SiP	Digital Test, Digital RF SoC Test
	FiPoP	Digital Test, Digital RF SoC Test
	L/T/VFBGA	Digital Test, Digital RF SoC Test
	PiP	Digital Test, Digital RF SoC Test
	PoP	Digital Test, Digital RF SoC Test
	T/VQFP	Digital Test, Digital RF SoC Test
Power Management	BCC	Power Logic Test
	QFN	Power Logic Test
	TSOP	Power Logic Test
Mobile Memory	Memory Dual Pro-stick	Memory Test
	MS Micro	Memory Test
	Mini-SD Card	Memory Test
	MS ProDuo	Memory Test
	SD Card	Memory Test
	SD-USB	Memory Test
	SD-SiP-SD	Memory Test
	USB Pro-stick	Memory Test
	MicroSD	Memory Test
Broadband/xDSL	TFBGA/-H	High-end Digital Test
	L/TQFP/-H	High-end Digital Test
	PBGA/-H	High-end Digital Test
Cable Modem	BGA	Mixed Signal Test, Digital Test
	LGA	Mixed Signal Test, Digital Test
	PBGA	Mixed Signal Test, Digital Test
	TQFP	Mixed Signal Test, Digital Test
Ethernet	TFBGA/-H	High-end Digital Test
	L/TQFP/-H	High-end Digital Test
	PBGA/-H	High-end Digital Test
Digital Signal Processing	L/TFBGA	Digital Test
	PBGA	Digital Test
	QFP	Digital Test

 

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