eWLB (FOWLP Technology)

Innovative Fan-out Wafer Level Technology





STATS ChipPAC offers a high performance fan-out wafer level packaging (FOWLP) solution that provides significant bandwidth, performance, form factor and cost benefits compared to other packaging technologies available today.





Proven Leadership in Innovative FO-WLP Solutions


  • Versatile FOWLP platform for advanced system level integration
  • Highest integration density commercially available in the industry today
  • Flexibility to integrate die from diverse processes, manufacturing sources & silicon wafer nodes for increased functionality
  • Excellent mechanical, electrical & thermal performance
  • Effectively accommodates new lithography nodes
  • Flexible, cost effective 2D, 2.5D & 3D solutions across a broad range of market segments & applications

    A breakthrough technology, embedded Wafer Level Ball Grid Array (eWLB) is a versatile fan-out wafer level packaging platform (FOWLP) designed to address the growing mismatch in interconnect gap, higher levels of integration, improved electrical performance and shorter vertical interconnects. The eWLB platform provides a more space-efficient package design enabling a smaller footprint, higher density input/output (IO) and lower package profiles than is possible with laminate or flip chip semiconductor packages.

    A Robust Manufacturing Process

    Assembled directly on a silicon wafer, this FOWLP approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market.
    STATS ChipPAC’s robust eWLB high volume manufacturing process includes automated wafer reconstitution (including wafer-level molding), redistribution using thin film technology, solder ball mount, package singulation and testing. Incoming wafers in both 200mm and 300mm diameters can be supported.

    The Most Comprehensive Fan-Out Portfolio in the Industry

    • Wide range of small die, large die, flip chip, stacked or side-by-side multi-die and ultra-thin options
    • Body sizes: 2.2 x 2.2mm – 14 x 14mm and expanding (package size dependent on die size)
    • 2.5D eWLB interposer solutions (replaces stacked package configurations or to enable 3D TSV)
    • 3D SiP and PoP solutions include embedded multiple passives and active components, face-to-back or face-to face options, and single-sided, 1.5-sided and double-sided PoP configurations (total stacked PoP height less than 0.1mm)

    A Versatile Platform for 2.5D and 3D Integration

    eWLB’s flexible manufacturing process can reduce substrate complexity and costs while achieving very dense interconnection in a range of reliable, low-warpage 2D, 2.5D and 3D solutions including small die, large die, stacked or side-by-side multi-die and ultra-thin options across a broad range of market segments and applications.

    2.5D Integration

    With advanced eWLB technology, customers have the flexibility to integrate die from diverse semiconductor processes and different silicon nodes into a cost effective 2.5D interposer solution. STATS ChipPAC’s eWLB based interposers enable very dense interconnection with more effective heat dissipation and improved processing speed in a proven, low-warpage packaging structure. The simplified materials supply chain and lower overall cost available with an eWLB based interposer provide a strong technology platform and path for customers to transition their devices to more advanced 2.5D and 3D packages.

    Flip Chip eWLB

    The basic structure of eWLB, thin film processing, has enabled STATS ChipPAC to create eWLB-based interposers that can connect one active die to another, enabling very dense interconnection with more effective heat dissipation, improved processing speed and the flexibility to integrate die from different manufacturing sources. The result is a proven 2.5D solution that is superior to TSV in terms of overall cost effectiveness and process simplicity.

    3D Integration

    STATS ChipPAC’s 3D SiP and PoP solutions include embedded multiple passives and active components, face-to-back or face-to face options, and single-sided, 1.5-sided and double-sided ultra-thin PoP configurations. For applications requiring full 3D integration, STATS ChipPAC’s face-to-face (marsupial) eWLB PoP configuration provides a direct vertical interconnection between an application processor die and a memory die through the eWLB mold layer to enable a high bandwidth, very fine pitch structure with performance that parallels TSV technology.
     

    eWLB Features

    eWLB technology provides significant performance, size and cost benefits, compared to other technology available today:

    PERFORMANCE
    • Unprecedented flexibility in 2.5D & 3D integration with Si partitioning capabilities
    • Advanced dielectric materials for highly reliable, power-efficient solutions
    • Strong electrical performance (capable to beyond 60GHz)
    • Highly effective heat dissipation for strong thermal performance
    • KGD process helps achieve strong yields (99.9%)

    FORM FACTOR
    • Maximum I/O density; 1.5-2X increase in routing density in the smallest, thinnest footprint commercially available today
    • Thin film processing enables very fine lines for X,Y routing (line-width/line-space ratios less than 10um/10um), very fine via pitches & thin dielectrics
    • Die-to-die, die-to-passives, and passives-to-passives placement distances below 100um
    • Fine pitch copper (Cu) column bumps provide tighter pitch for 2.5D/3D designs
    • Industry’s thinnest 3D PoP solutions (ultra thin z-height of 0.3mm with stacked thickness down to 0.8mm height)

    COST
    • Well established, high volume manufacturing process enables scaling devices to larger panel sizes for compelling cost reduction
    • Thin film interconnection offers lowest cost structure over competing advanced manufacturing approaches
    • Elimination of substrate results in a thinner package with lower warpage, simplifes supply chain & reduces costs
    • 2.5D and 3D options offers a more cost effective & infrastructure-friendly alternative to expensive TSV integration

    eWLB Process Flow

    eWLB manufacturing is distinguished by an innovative process where an artificial wafer is created by embedding pre-diced silicon chips onto a blank metal carrier.
    1) Reconstituted wafer

    Wafer saw and pick-and-place from incoming wafer
    Probed good die
    Molded reconstituted wafer using proven materials
    Molded artificial wafer starting point for thin film technology
    2) Redistribution
    Thin film technology with advanced design rules
    Standard thin film equipment
    Proven and reliable material set
    3) Ball Mount and Singulation
    Standard back-end assembly flow (and equipment)
    4) Test, Mark, Scan, Pack
    Standard or wafer level-based test flow
    Standard assembly






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