Package Families

Flip Chip Packages

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A broad Flip Chip portfolio--from large single die packages with passive components to modules and complex advanced 3D packaging, with a variety of low cost options.
Your Go-To Provider of Flip Chip Solutions
Flip Chip packaging, in which the silicon die is directly attached to the substrate using solder bumps instead of wirebonds, provides the most dense interconnect with the highest electrical and thermal performance. Flip Chip technology is used in a wide array of applications ranging from consumer products to highly sophisticated ASICs, PC chipsets, graphics and memory packages. Flip Chip interconnection provides the ultimate in miniaturization, reduced package parasitics and enables new paradigms in the area of power and ground distribution to the chip, which are not feasible in other traditional packaging approaches. STATS ChipPAC's sizeable flip chip portfolio ranges from large single die fcBGA packages with passive components used for graphics, CPU and ASIC devices to smaller fcFBGA packages including single die, multi-die and stacked configurations that combine wirebond and flip chip technology within a single package to bare die and molded laser flip chip PoP options.

flip chip with Cu Column, BOL and Enhanced Processes

Flip Chip Redefined
STATS ChipPAC experienced significant growth of its unique fcCuBE® technology in 2013. fcCuBE is a low cost, high performance advanced flip chip packaging technology that features copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and other enhanced assembly processes. Since receiving its first fcCuBE-related patent in 2006 on the innovative BOL process, STATS ChipPAC has invested heavily over the years in developing this transformative technology into the flip chip platform of choice for mobile applications such as smartphones and tablets as well as consumer applications such as GPS and set top box ICs.

copper column bumps The advantages of fcCuBE® are driving wider customer adoption from cost sensitive markets such as mobile and consumer to networking and cloud computing where increased routing density and performance are imperative. fcCuBE’s unique BOL interconnect structure provides scalability to very fine bump pitches and high I/O while alleviating stress-related chip to package interaction (CPI), a common phenomenon associated with lead free and copper column bump structures. This is particularly important for mid- to high-end networking and consumer applications such as Ethernet processor, graphics processing units (GPUs), network storage ICs, memory controllers and digital television (DTV) ICs.

Full Turnkey Flip Chip Services at STATS ChipPAC

With our unmatched strength in wafer level packaging, wafer probe and final test, STATS ChipPAC is uniquely positioned to provide full turnkey processing to our customers. STATS ChipPAC offers full turnkey flip chip services ranging from design through production, including high speed, high pin count digital and RF testing.


 

 

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