White Papers

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Note: All STATS ChipPAC white papers are in Adobe PDF format. The Adobe Acrobat Reader is required to view PDF files. Acrobat Reader is free and may be downloaded directly from Adobe.
Wafer Level Packaging Technologies
FOWLP eWLB Technology as an Advanced SiP Solution [2017] Download
Innovative Integration Solutions for SiP Packages Using Fan-out WLP [2017] Download
Reliability of eWLB for Automotive Radar [2017] Download
28nm Chip-to-Package Interaction in Large Size eWLB [2017] Download
Board Level Reliability of Automotive eWLB FOWLP [2016] Download
Advanced Wafer Level Packaging of RF-MEMS with RDL Inductor [2016] Download
Board Level Reliability Improvement in eWLB Packages [2016] Download
3D Integrated eWLB FOWLP Technology for PiP and SiP [2016] Download
Challenges and Improvement of Reliability in Advanced Wafer Level Packaging [2016] Download
Advanced 3D eWLB-PoP Technology [2016] Download
Panel Level Advanced Packaging [2016] Download
Advanced Wafer Level Technology Enabling Innovations [2015] Download
Advanced 3D eWLB PoP Technology [2015] Download
Modeling Correlation for Solder Joint_Fatigue Life Estimation in WLCSP [2015] Download
Integration Through Wafer Level Packaging Approach [2015] Download
Ultra Fine Pitch RDL Development in Multi-Layer eWLB Packages [2015] Download
WLCSP+ and eWLCSP in FlexLine Innovative Wafer Level Package Manufacturing [2015] Download
FlexLineTM - a Universal Wafer Level Platform for Fan-In and Fan-Out Designs [2014] Download
Encapsulated WLCSP (eWLCSP) for Cost Effective and Robust Solutions in FlexLineTM [2014] Download
Innovative Wafer Level Package Manufacturing with FlexLineTM [2014] Download
FlexlineTM - A Flexible Manufacturing Method for Wafer Level Packages [2014] Download
Automated Metrology Improves Productivity and Yields for Wafer Level Packages in HVM [2014] Download
Solder Joint Fatigue Life Prediction in Large Size and Low Cost Wafer-Level Chip Scale Packages [2014] Download
Encapsulated Wafer Level Package Technology (eWLCSP) [2014] Download
Development of Exposed Die Large Body to Die Size Ratio Wafer Level Package Technology [2014] Download
System-in-Package (SiP)
FOWLP eWLB Technology as an Advanced SiP Solution [2017] Download
Microelectronics Innovative Integration Solutions for SiP Packages Using Fan-out WLP [2017] Download
3D Integrated eWLB FOWLP Technology for PiP and SiP [2016] Download
Advanced 3D eWLB-PoP Technology [2016] Download
Advanced 3D embedded Wafer Level BGA PoP Technology [2015] Download
Advanced Wafer Level Technology Enabling Innovations [2015] Download
Design and Material Contributions to Second-Harmonic Nonlinearities in RF Silicon IPD [2014] Download
TSV MEOL (Mid End of Line) and Packaging Technology of Mobile 3D IC Stacking [2014] Download
Micro Electro-Mechanical Systems (MEMS)
Advanced Wafer Level Packaging of RF-MEMS with RDL Inductor [2016] Download
Advanced Wafer Level Technology Enabling Innovations [2015] Download
Flip Chip Interconnect
Fine Pitch Cu Pillar Assembly Challenges for Advanced Flip Chip Packages [2017] Download
Fine Pitch High Bandwidth Flip Chip Package-on-Package Development [2017] Download
Fine Pitch Cu Pillar with BOL Assembly Challenges for Low Cost and High Performance Flip Chip Package [2017] Download
Large Flip Chip Assembly Challenges and Risk Mitigation Process [2017] Download
10nm CPI Study for Fine Pitch Flip Chip Attach Process and Substrate [2017] Download
Advanced Packaging for Automotive Dashboard Application [2017] Download
Ultra-Thin Substrate Assembly Challenges for Advanced Flip Chip Package [2016] Download
Thin Profile Flip Chip Package-on-Package Development [2016] Download
Fine Pitch Cu Pillar with BOL Assembly Challenges for High Performance Flip Chip Package [2016] Download
Advanced Flip Chip Package on Package [2016] Download
Design and Stress Analysis for Fine Pitch Flip Chip Packages with Cu Column Interconnects [2014] Download
Optimization of Compression Bonding Processing Temp for Fine Pitch Cu Col Flip Chip Devices [2014] Download
Electromigration for Advanced Cu Interconnect and the Challenges with Reduced Pitch Bumps [2014] Download
Wirebond
Behaviors of QFN Package on a Leaframe Strip [2016] Download
Study of Intermetallic Compound Growth and Failure Mechanisms in Silver Bonding Wire Reliability [2014] Download
Electrical-Thermal Characterization of Wires in Packages [2014] Download
A Study on the Electrical Characteristics of Different Wire Materials [2013] Download
Warpage Mitigation Processes in the Assembly of Large Body Size Mixed Pitch BGA Coreless Packages for Use in High Speed Network Applications [2013] Download
 

 

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