Design Services

Full-Service Packaging Design Centers

STATS ChipPAC's worldwide design centers offer full-service design capabilities to assist customers in creating the optimum package at the lowest cost. STATS ChipPAC has the experience to support the most demanding and complex package designs that meet our customers performance, manufacturing and cost requirements.   

STATS ChipPAC’s Design Center services include:
  • Customer-centric designers
  • Mobile design capability
  • State-of-the-art design tools
  • Integration of customer supplied designs into STATS ChipPAC’s design system
  • Project data management

Proven Experience

STATS ChipPAC's world class design team has extensive experienced in the mobile, networking, computing, consumer and automotive markets. Their experience covers a wide range of array, leadframe and wafer level package designs, including single die, multi-die, Package-on-Package (PoP), Integrated Passive Devices (IPD) and advanced System-in-Package (SiP). STATS ChipPAC’s dedicated design team has the necessary experience to provide complex designs that meet or exceed assembly and cost targets.

Design for Performance

Today's package designs adhere to stringent thermal and electrical requirements while providing high-end performance for our customers’ end products. To insure a semiconductor package will meet performance requirements, STATS ChipPAC’s Design and Characterization Team works closely with the customer through co-design while the integrated circuit (IC) is in development. The “Co-Design” of a package provides the best environment for optimum performance. STATS ChipPAC’s package designs meet our customers’ needs whether as a single chip device or complex System-in-Package (SiP).   

The Design Process

STATS ChipPAC manages the design process using our Product Data Management system. From the moment a request enters our system the design team works with our characterization experts and our customers to understand their needs for each design. As each new design is received, it undergoes a feasibility to determine if the package will meet the requirements of our factories, suppliers and customers. Our designers collaborate with customers to ensure the optimum package is produced with consideration to cost, assembly and function. 

Design Tool Sets

  • Cadence: SiP and APD
  • AutoDesk: AutoCad
  • Downstream: Cam350
  • Internally developed support tools


 

 

Print page