Memory Device Technology

Memory Devices

Memory Devices
STATS ChipPAC offers a variety of memory card formats in addition to value-added package assembly and test services. A majority of our card packaging processes are common with traditional packaging and leverage the most up-to-date technologies and processes unique to memory cards, including integrated curve-cutting, labelling, mechanical card assembly and card packaging. STATS ChipPAC provides solutions that utilize bare die level assembly, pre-packaged die assembly or a combination of both. The Micro-SD is an example of an integrated solution using NAND and controller die while the SD-USB is an example of bare die, pre-packaged die and SMT components. In addition to assembly, STATS ChipPAC offers memory and card test services, with dedicated test resources to support test development as required.

Flash Memory Card Formats

  • SD Card
  • Mini SD
  • Micro SD
  • Memory Stick
  • MS Pro Duo

USB Flash Drive Formats

  • SD USB
  • USB Module

Traditional Embedded Discrete Memory Formats

  • TSOP
  • FBGA


  • Body sizes up to 20 x 30mm
  • Traditional IC Packaging process flows
  • Wafer Backgrinding & Polishing
  • Surface Mount Technology
  • Die Stacking
  • Die Level & Pre-packed Memory supported
  • Die Attach with Epoxy & Film
  • Wire Bonding (Traditional, Reverse, FFL, etc.)
  • Vacuum Molding
  • Laser & Ink Marking
  • Singulation using Blade, WaterJet, Edge Grinder or Laser
  • Chamfering
  • Lid Attach using B-Stage Epoxy or Ultrasonic Welder
  • Mechanical Card Assembly
  • Label Attach
  • High Speed Integrated Curve-Cutting
  • Lead-free & green materials set
  • Memory & Final Test capabilities


  • Digital Still & Video Cameras
  • Mobile Handsets
  • GPS Devices
  • PDAs, MP3 Players, etc.


Print page