Your Go-To Provider for a Broad Range of Advanced and Standard Wirebond Package SolutionsWire bonding forms an interconnection between a chip to a substrate, substrate to a substrate, or substrate to a package. Wire bonding is generally considered the most cost-effective and flexible interconnect technology, and is used to assemble the vast majority of semiconductor packages today.
Wire bond interconnection is available in a number of packaging approaches at STATS ChipPAC:
A lower cost alternative to gold, copper wire is becoming the material of choice for interconnection in wirebond packages. Copper wire provides similar electrical characteristics and performance to gold wire with lower resistivity, which can be a benefit where lower bond wire resistance is needed for device performance. STATS ChipPAC is ready to engage on all wirebond package types with a Best Value BOM for each package to enable the most cost-effective copper wirebond solution. Laminate Packages
Laminate-based Ball Grid Array interconnect technology (BGA) was first introduced as a solution to the increasingly high lead counts required for advanced semiconductors. BGA technology features leads on the bottom surface of the package in the form of small bumps or solder balls, and provides low inductance, ease of surface mounting, relatively low cost, and excellent package reliability. STATS ChipPAC offers a full suite of laminate-based BGA packages, including fine pitch, extremely thin, multi-die, stacked and thermally enhanced configurations.
In addition to standard laminate packages, STATS ChipPAC offers a broad portfolio of advanced stacked package options including a range of package-on-package (PoP) and package-in-package (PiP) configurations.Leadframe Packages
Leaded packages are characterized by a die encapsulated in a plastic mold compound with metal leads surrounding the perimeter of the package. This simple and low-cost packaging is still the best solution for many applications. STATS ChipPAC provides a comprehensive range of leadframe package solutions from standard leadframe packages to low profile, small and thin, thermally enhanced packages, including quad flat packages (QFP), quad / dual flat no-lead packages (QFN / DFN) and thin, small outline profile packages (TSOP). Memory Devices
STATS ChipPAC offers memory card packaging in two formats, Micro-SD and SD-USB, in addition to value-added package assembly and test services. The Micro-SD is an integrated solution using NAND and controller die, while the SD-USB is a bare die, pre-packaged die with SMT components. STATS ChipPAC’s memory card solutions utilize bare die level assembly, pre-packaged die assembly or a combination of both. Full Service Packaging Design
We collaborate with customers on die and package designs to provide the best possible products in terms of performance, quality, cycle time and cost. STATS ChipPAC’s full-service package Design Centers help customers determine the optimum package for complex integrated circuits, and can assist customers in designing the most appropriate package for their specific device.