STATS ChipPAC Semiconductor (Jiangyin) Co., Ltd.
Jiangyin Hi-tech Technology Industry Development Zone
No. 78 Changshan Rd, Jiangyin
Jiangsu Province 214437
People's Republic of China
In operation since 1994, STATS ChipPAC's operation in China has always emphasized low cost with consistent high quality and yields, short cycle time and dependable on time delivery. STATS ChipPAC's 908K ft² (84K m²) operation in JiangYin offers high quality, high volume, low cost turnkey solutions including wafer probe, backgrind, assembly, final test and distribution services, supporting multiple customers in markets such as PC chipsets, network, memory, consumer, automotive, finger print, MEMS and broadband applications.
A broad package portfolio
STATS ChipPAC JiangYin supports a broad package portfolio of leaded, laminate, stacked die, memory card and Flip Chip assembly services. With high volume production experience in Flip Chip, wire bond BGA, QFN, QFP, TSOP packages, three dimensional (3D) stacking, memory card and System-in-Package (SiP) solutions, STATS ChipPAC provides high quality packaging solutions that are cost competitive for customers. STATS ChipPAC JiangYin‘s technology capabilities also include advanced die attach and wire bond processes, advanced mold processes, film die attach and wafer thinning.