About Us

STATS ChipPAC Senior Management

Lai Chih-Ming

Lai Chih-Ming

Chief Executive Officer
Mr. Lai Chih-Ming is currently the Chief Executive Officer of the Company and a member of our Board of Directors. He is also the chief executive officer of Jiangyin Changdian Advanced Packaging Co. Ltd. (“JCAP”), a subsidiary controlled by JCET. He joined JCET in 2001 as executive vice president and established JCAP in 2003 and has been acting as the chief executive officer of JCAP since then. Mr. Lai established the first 12”/8” CuP/WLCSP packaging and assembly production line in China. Mr. Lai is also the Vice Chairman of Electronic Manufacturing Packaging Technology Branch of Chinese Institute of Electronic.
Woo Kwek Kiong

Woo Kwek Kiong

Chief Financial Officer
Mr. Woo Kwek Kiong joined us as our Chief Financial Officer in August 2015 and was appointed to our Board of Directors in February 2017. Prior to joining us, he was Chief Financial Officer at Advanpack Solutions Pte Ltd, a subsidiary of Jiangsu Changjiang Electronics Technology, with overall responsibility for the financial and accounting procedures in compliance with the standard and regulatory requirements as well as actively involved in its strategic business development. Prior to that, he was the Chief Financial Officer of ASTI Holdings, a leading provider of semiconductor manufacturing services, listed on the Singapore Stock Exchange, and had also held senior financial positions at various companies. He started his career with KPMG Mr Woo holds a Bachelor of Accountancy with Second-class Upper Division Honours from National University of Singapore and also a member of the Institute of Singapore Chartered Accountants.
Hal Lasky

Hal Lasky

Executive Vice President and Chief Sales Officer
Mr. Hal Lasky joined us as Chief Sales Officer in March 2008. Prior to joining us, Mr. Lasky spent 24 years at IBM where he held a number of key leadership positions, most recently as Vice President of Worldwide Semiconductor Sales for IBM's Global Engineering Solutions group with responsibility for worldwide semiconductor revenue, sales strategy and strategic relationships with clients in the consumer, communications and information techology markets. Prior to that, he held various senior management positions in IBM's Systems and Technology Group, Microelectronics Business Line and Interconnect Products Business Line. Mr. Lasky holds a Bachelor of Science in Ceramic Engineering from Rutgers University and a Master in Materials Science and Engineering from Columbia University. He is also a graduate of the IBM Client Executive Program at Harvard Business School.
Shim Il Kwon

Shim Il Kwon

Chief Technology Officer
Mr. Shim Il Kwon has been Chief Technology Officer since August 2015. He joined our company in 2000 and has held several technology leadership positions including Vice President, Head of Corporate Technology Innovation and Vice President, Head of Research and Development before being appointed as Senior Vice President. Prior to joining us, Mr. Shim was with Amkor Technology in Korea and the U.S. where he held various product development and management positions in the Advanced Product Development Group. Mr. Shim holds more than 150 patents granted by the U.S. Patent and Trademark Office. He received both his Bachelor of Science and Master of Science degrees from Chungnam National University in Korea. Mr. Shim also studied doctoral programs in Material Science and Engineering from Korea Advanced Institute of Science and Technology (KAIST) in Seoul, Korea.
 

 

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