Worldwide Locations

STATS ChipPAC Korea (SCK) Profile

STATS ChipPAC Korea Ltd. (SCK3)
191 Jayumuyeok-ro
Jung-gu, Incheon 400-340 South Korea
Tel: 032-340-3114










STATS ChipPAC KoreaSTATS ChipPAC Korea Ltd. (SCK1)
2091 Kyungchungdae-ro
Bubal-eub, Icheon-si
Kyoungki-do, 467-701 South Korea
Tel: 82-31-639-8888
Fax: 82-31-635-9973








STATS ChipPAC KoreaSTATS ChipPAC Korea Ltd.  (SCK2)
180-63 Duckee-ro
Majang-myeon, Icheon-si
Kyoungki-do, 467-814 South Korea
Tel: 82-31-639-1700
Fax: 82-31-645-1707








STATS ChipPAC's Korean operation provides a full range of integrated services ranging from initial package design to final test and burn-in. Its 770,000 square foot, high end operation in Ichon (SCK1) specializes in advanced array packaging such as Flip Chip, Stacked Die, Chip Scale Packaging and Ball Grid Array. A second 212,000 square foot operation located in Majang-Myeon, Ichon (SCK2) offers full turnkey 3D services.

A new facility, SCK3, located in the Inchon Airport Free Trade Zone(IFTZ), is slated for final completion by June 2015, the new facility is in excess of 100,177 m² (1,078,296 ft²) and will integrate SCK’s two existing facilities into a single large operation. SCK3 is strategically located in the Yeongjongdo development area of the Incheon Free Economic Zone (IFEZ) which is approximately 50 km from Seoul and close to the Incheon International Airport. The new location is approximately one hour from the current SCK facilities in Ichon. The new SCK3 factory includes an institute of technology, office area, warehouse, utility facilities, dormitories, dining facilities and other amenities. The expanded manufacturing area enables SCK to provide advanced flip chip, wirebond and 3D packaging solutions with a more efficient and cost effective manufacturing flow.

Focus on Advanced Technologies

STATS ChipPAC Korea has a strong focus on high end, advanced packaging technologies including:
  • Complex multi-die packages and 3D packaging with an emphasis on die stacking
  • System-in-Package (SiP), Package-on-Package (PoP) and Package-in-Package (PiP)
  • High end Flip Chip
  • PBGA with finer bond pitch and higher pin count with heat spreaders

Test Center of Excellence

STATS ChipPAC Korea is a production test and test center of excellence for high speed, high pin count logic and memory test in support of Stacked Die FBGA products

Research and Development

STATS ChipPAC’s Korean operation is also the primary R&D Center for complex Stacked Die, Flip Chip assembly, SiP, PiP, PoP and most enabling technologies.

Quality Certifications

  • ISO 9001
  • ISO 14001
  • ISO/TS 16949
  • OHSAS 18001
  • Sony Green Partner