STATS ChipPAC Shanghai (SCC) Profile
STATS ChipPAC Shanghai Co., Ltd
188 Hua Xu Road
Xujin County, Qingpu District
People's Republic of China
In operation since 1994, STATS ChipPAC's China operation has always emphasized low cost with consistent high quality and yields, short cycle time and dependable on time delivery. Currently located in Shanghai's Xi Jiao Economic and Technological Development Zone, STATS ChipPAC Shanghai's 983K ft² (91K m²) operation offers high quality, high volume, low cost turnkey solutions including wafer bumping (Eutectic, Pb free Cu Column Bump), wafer probe, backgrind, assembly, final test and distribution services, supporting multiple customers in markets such as PC chipsets, computing, consumer and broadband applications.
A broad package portfolio
STATS ChipPAC Shanghai supports a broad package portfolio of leaded, laminate, stacked die, memory card and Flip Chip assembly services. With high volume production experience in Flip Chip, Plastic Ball Grid Array (PBGA) packages, three dimensional (3D) stacking, memory card and System-in-Package (SiP) solutions, STATS ChipPAC provides high quality packaging solutions that are cost competitive for customers. STATS ChipPAC Shanghai‘s technology capabilities also include advanced die attach and wirebond processes, advanced mold processes, film die attach and wafer thinning.