Worldwide Locations

STATS ChipPAC Shanghai (SCC) Profile

STATS ChipPAC Shanghai (SCC)STATS ChipPAC Shanghai Co., Ltd
188 Hua Xu Road
Xujin County, Qingpu District
Shanghai 201702
People's Republic of China
Tel: 86-21-5976-5858
Fax: 86-21-5976-3838

One of the Largest OSATs in China

In operation since 1994, STATS ChipPAC's China operation has always emphasized low cost with consistent high quality and yields, short cycle time and dependable on time delivery, and is meeting growing market demand as the largest full turnkey assembly and test service provider in China. Located in Shanghai's Xi Jiao Economic and Technological Development Zone, STATS ChipPAC Shanghai's 983,276 square foot operation offers high quality, high volume, low cost turnkey solutions including wafer bumping (Eutectic, Pb free Cu Column Bump), wafer probe, backgrind, assembly, final test and distribution services, supporting multiple customers in markets such as PC chipsets, computing, consumer and broadband applications.

A broad package portfolio

STATS ChipPAC Shanghai supports a broad package portfolio of leaded, laminate, stacked die, memory card and Flip Chip assembly services. With high volume production experience in Flip Chip, Plastic Ball Grid Array (PBGA) packages, three dimensional (3D) stacking, memory card and System-in-Package (SiP) solutions, STATS ChipPAC Shanghai is one of the most advanced integrated circuit (IC) subcontractors in China. STATS ChipPAC Shanghai‘s technology portfolio also includes advanced die attach and wirebond processes, advanced mold processes, film die attach and wafer thinning.

Making it easy to do business in China

One of the largest import and export companies in Shanghai, STATS ChipPAC Shanghai has earned a Grade AA customs rating thus enabling it to offer:
  • Access to the “green channel”
  • Priority/simplified customs treatment

Quality Certifications

  • ISO 9002
  • ISO 14001
  • Q9000
  • TS 16949
  • OHSAS 18001
  • Sony Green Partner



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