Corporate Headquarters
STATS ChipPAC Ltd.
10 Ang Mo Kio Street 65
#05-17/20 Techpoint
Singapore 569059
Tel: 65-6824-7777
Fax: 65-6720-7829 (Legal matters)
65-6720-7826 (Investor Relations matters)
Headquartered in Singapore, STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of advanced semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications, consumer, automotive and industrial markets.
A trusted partner and supplier to leading semiconductor companies worldwide, STATS ChipPAC provides fully integrated, multi-site, end-to-end packaging and testing solutions that bring products to the market faster. Our customers are some of the largest wafer foundries, integrated device manufacturers (IDMs) and fabless companies in the United States, Europe and Asia.
US Headquarters
STATS ChipPAC Inc.
47400 Kato Road
Fremont, CA 94538 USA
Tel: 510-979-8000
Fax: 510-979-8001