STATS ChipPAC’s Corporate Development team is dedicated to exploring, investing, partnering, and participating in strategic ventures with semiconductor companies globally.
We are interested in investing and partnering with leading-edge technology companies in the following key areas: advanced packaging technologies including Flip Chip, Wafer Bumping, Stacked Die and 3D, supply chain management (SCM) solutions, test and cost management.
We are also interested in expanding our market share and global facilities through strategic investment opportunities and synergistic partnerships. We are seeking technology alliances and acquisitions that fit with our core competencies in assembly and test. STATS ChipPAC is actively seeking partners who are aligned with those core business competencies.
The Corporate Development team would like to hear about your company and its potential fit with STATS ChipPAC.