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STATS ChipPAC Press Releases

Aug 30, 2010STATS ChipPAC Achieves Major Milestone of Over 35 Million eWLB Units Shipped
Aug 30, 2010STATS ChipPAC Announces Expiration and Final Results of its Tender Offer for its 6.75% Senior Notes due 2011
Aug 10, 2010STATS ChipPAC Announces Early Results of the Tender Offer and Consent Solicitation for its Existing 6.75% Senior Notes due 2011
Aug 04, 2010STATS ChipPAC Announces Pricing of New Senior Notes
Jul 30, 2010STATS ChipPAC Announces Tender Offer and Consent Solicitation for its Existing Senior Notes and Private Placement of New Senior Notes
Jul 30, 2010STATS ChipPAC Reports Second Quarter 2010 Results
Jul 18, 2010STATS ChipPAC – Drawdown under Credit Facility for Redemption at Maturity of US$150.0 million 7.5% Senior Notes due July 19, 2010
May 25, 2010STATS ChipPAC Drives Innovation in Low Cost Flip Chip Technology with Copper Column Bump
May 18, 2010STATS ChipPAC Honors 2009 Supplier Excellence Award Winners
May 10, 2010STATS ChipPAC Honored by Samsung with Best Supplier Award
May 06, 2010STATS ChipPAC Receives AMD’s World Class Supplier Achievement Award
Apr 26, 2010STATS ChipPAC Reports First Quarter 2010 Results
Apr 12, 2010STATS ChipPAC First to Implement 300mm Manufacturing for eWLB Technology
Mar 23, 2010STATS ChipPAC Receives Analog Devices’ Supplier Excellence Award for the Second Consecutive Year
Jan 27, 2010STATS ChipPAC Reports Fourth Quarter and Full Year 2009 Results
Jan 14, 2010STATS ChipPAC Receives Intersil’s Supplier of the Year Award
Nov 29, 2009STATS ChipPAC Ramps eWLB Technology to High Volume Production
 

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