STATS ChipPAC Singapore (SCS) Profile

In operation since 1994, STATS ChipPAC's Singapore facility features a 594,738 square foot assembly and test operation with state-of-the-art equipment and a Class 10K clean room environment. The Singapore operation provides full turnkey services including wafer bump & RDL, IPD, wafer probe, packaging, final testing and drop shipment.

STATS ChipPAC Singapore offers advanced assembly services, supporting a wide array of advanced leadframe (QFP and punched QFN) and laminate based products (PBGA, PBGA-H, LFBGA), with die stacking also available.

STATS ChipPAC Singapore also offers a broad and comprehensive test capability in support of a broad range of package types. SCS is a full service provider for wafer sort, final package test, strip test, wafer bump and all wafer level products. In addition, the Singapore test operation is a center of excellence for testing high-end RF and mixed signal devices as well as high-speed digital devices.

Quality Certifications

• ISO 9001: 2000
• ISO 9001
• ISO 9002
• ISO 14001
• ISO / TS16949: 2002
• OHSAS 18001
• Sony Green Partner
• QOS and QOS+ Systems
• QS9000
• SAC Level 1

 

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