STATS ChipPAC Korea (SCK) Profile

STATS ChipPAC's 951,246 total square footage Korean operation provides a full range of integrated services ranging from initial package design to final test and burn-in. Its 769,955 square foot, high end operation in Ichon specializes in advanced array packaging such as Flip Chip, Stacked Die, Chip Scale Packaging and Ball Grid Array. A second 181,291 square foot operation located in Majang-Myeon, Ichon, expected to be in full operation by late 2008, will focus on offering full turnkey 3D services.

Focus on Advanced Technologies

STATS ChipPAC Korea has a strong focus on high end, advanced packaging technologies including:

• Complex multi-die packages and 3D packaging with an emphasis on die stacking
• System-in-Package (SiP), Package-on-Package (PoP) and Package-in-Package (PiP)
• High end Flip Chip
• PBGA with finer bond pitch and higher pin count with heat spreaders

Test Center of Excellence

STATS ChipPAC Korea is a production test and test center of excellence for high speed, high pin count logic and memory test in support of Stacked Die FBGA products

Research and Development

STATS ChipPAC’s Korean operation is also the primary R&D Center for complex Stacked Die, Flip Chip assembly, SiP, PiP, PoP and most enabling technologies.

Quality Certifications

• ISO 9001
• ISO 14001
• ISO/TS 16949
• OHSAS 18001
• Sony Green Partner

 

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